Yu-ying Lee

5 Patents

• US123157852025

  Semiconductor Device Package

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US120339342024

  Package Structure, Optical Structure and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US118625502024

  Electronic Package Structure and Method of Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US117842962023

  Semiconductor Device Package and a Method of Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US115691792023

  Package Structure Including an Outer Lead Portion and an Inner Lead Portion and Method for Manufacturing Package Structure

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites