13 Patents
- US124842122025Semiconductor Device Structure Having Channel Layer with Reduced Aperture and Method for Manufacturing the Same
NANYA TECHNOLOGY CORPORATION
0 cites - US124329052025Semiconductor Device Structure Having Channel Layer with Reduced Aperture and Method for Manufacturing the Same
NANYA TECHNOLOGY CORPORATION
0 cites - US123549962025Glass Carrier for Die-up Fan-out Packaging and Methods for Making the Same
CORNING INCORPORATED
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- US120843732024Glass Carriers for Fan-out Packaging Having Target Coefficients of Thermal Expansion and Methods for Making the Same
CORNING INCORPORATED
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- US118759932024Low Warp Fan-out Processing Method and Production of Substrates Therefor
CORNING INCORPORATED
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- US117758802023Intelligent Reservation Method and Device for Seat, and Computer-readable Storage Medium
BOE TECHNOLOGY GROUP CO., Ltd.
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