12 Patents
- US125640662026Semiconductor Structure Having Passive Component and Method of Manufacturing Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US125123722025Semiconductor Structure with Testing Pads and Method of Manufacturing Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US124776952025Two-phase Immersion-cooling Heat-dissipation Structure Having Skived Fins
AMULAIRE THERMAL TECHNOLOGY, Inc.
0 cites - US124328832025Two-phase Immersion-type Heat Dissipation Structure Having Acute-angle Notched Structures
AMULAIRE THERMAL TECHNOLOGY, Inc.
0 cites - US123961312025Two-phase Immersion-cooling Heat-dissipation Structure Having Shortened Evacuation Route for Vapor Bubbles
AMULAIRE THERMAL TECHNOLOGY, Inc.
0 cites - US122898652025Two-phase Immersion-cooling Heat-dissipation Composite Structure Having High-porosity Solid Structure and High-thermal-conductivity Fins
AMULAIRE THERMAL TECHNOLOGY, Inc.
0 cites - 0 cites
- US122625112025Two-phase Immersion-type Heat Dissipation Device Having Reinforced Fins
AMULAIRE THERMAL TECHNOLOGY, Inc.
0 cites - US122074452025Two-phase Immersion-type Composite Heat Dissipation Device
AMULAIRE THERMAL TECHNOLOGY, Inc.
0 cites - US121085742024Two-phase Immersion-type Heat Dissipation Structure Having Fins for Facilitating Bubble Generation
AMULAIRE THERMAL TECHNOLOGY, Inc.
0 cites - 0 cites
- US115629682023Apparatus for Lithographically Forming Wafer Identification Marks and Alignment Marks
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites