Yu-shen Chen

3 Patents

• US123241002025

  Circuit Board Assembly and Manufacturing Method Thereof

  UNIMICRON TECHNOLOGY Corp.

  0 cites
• US117929392023

  Substrate with Buried Component and Manufacture Method Thereof

  UNIMICRON TECHNOLOGY Corp.

  0 cites
• US116705202023

  Package Structure with Interconnection Between Chips and Packaging Method Thereof

  UNIMICRON TECHNOLOGY Corp.

  0 cites