Patents/Inventors

Yu Iwai

Haibara-gunJP1 patent

2 Patents

US118605382024
Photosensitive Resin Composition, Heterocyclic Ring-containing Polymer Precursor, Cured Film, Laminate, Method for Producing Cured Film, and Semiconductor Device
FUJIFILM Corporation
0 cites
US115674052023
Photosensitive Resin Composition, Polymer Precursor, Cured Film, Laminate, Method for Producing Cured Film, and Semiconductor Device
FUJIFILM Corporation
0 cites