6 Patents
- US126044202026Sensor Package Structure and Manufacturing Method Thereof
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US125752042026Sensor Package Structure and Manufacturing Method Thereof
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
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- US117681662023System and Method for Measuring Void Fraction of Inside of Heat Conduction Member
NATIONAL TAIWAN UNIVERSITY
0 cites - 0 cites