Patents/Inventors

Yu-cheng Pai

TaichungTW6 patents

2 Patents

US126222982026
Electronic Package, Packaging Substrate and Fabricating Method Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites
US124697742025
Electronic Package and Substrate Structure Thereof
SILICONWARE PRECISION INDUSTRIES CO., Ltd.
0 cites