12 Patents
- US124179812025Semiconductor Device Including Graphene Interconnect and Method of Making the Semiconductor Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122117402025Interconnect Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121130212024Graphene-assisted Low-resistance Interconnect Structures and Methods of Formation Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120682532024Semiconductor Structure with Two-dimensional Conductive Structures
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US120682542024Interconnection Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120516452024Two 2D Capping Layers on Interconnect Conductive Structure to Increase Interconnect Structure Reliability
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120274192024Semiconductor Device Including Liner Structure
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US119488372024Semiconductor Structure Having Vertical Conductive Graphene and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119087942024Protection Liner on Interconnect Wire to Enlarge Processing Window for Overlying Interconnect Via
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117107002023Graphene-assisted Low-resistance Interconnect Structures and Methods of Formation Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116705952023Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116409402023Methods of Forming Interconnection Structure Including Conductive Graphene Layers
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites