Youngsoo Jang

6 Patents

• USRE0506672025

  Electronic Device Including Housing Containing Metallic Materials

  Samsung Electronics Co., Ltd.

  0 cites
• US123477952025

  Semiconductor Package Including Uneven Structures and Electronic Device Including the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US122835762025

  Electronic Device Including Thermal Interface Material Layer and Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US121116882024

  Electronic Device Including Housing and Manufacturing Method Thereof

  Samsung Electronics Co., Ltd.

  0 cites
• US120221792024

  Electronic Device Including Structure That Reduces Vibration in Camera Module

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US116502372023

  Method of Manufacturing an Integrated Circuit Involving Performing an Electrostatic Discharge Test and Electrostatic Discharge Test System Performing the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites