4 Patents
- US124514002025Semiconductor Package Having Improved Heat Dissipation Characteristics
Samsung Electronics Co., Ltd.
0 cites - US123946872025Semiconductor Package Including a Heat Dissipation Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US118546482023Method of Resetting Storage Device, Storage Device Performing the Same and Data Center Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites