Patents/Inventors

Younglyong Kim

Suwon-siKR14 patents

11 Patents

US125820092026
Semiconductor Package Including Pads
Samsung Electronics Co., Ltd.
0 cites
US125688682026
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US125124462025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US124761792025
Semiconductor Package Including Through-silicon via and Method of Forming the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123410742025
Semiconductor Package with Increased Thermal Dissipation
Samsung Electronics Co., Ltd.
0 cites
US122372902025
Semiconductor Packages and Methods of Manufacturing the Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites
US121660132024
Semiconductor Package, and a Package on Package Type Semiconductor Package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120339732024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US118174432023
Semiconductor Package Including a First Semiconductor Chip with a Plurality of First Chip Pads Directly Bonded to a Plurality of Second Chip Pads of an Upper Semiconductor Chip
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116768752023
Semiconductor Package Including Non-conductive Film Between Package Substrate and Semiconductor Chip Thereon
Samsung Electronics Co., Ltd.
0 cites
US115812342023
Semiconductor Package with Improved Heat Dissipation
Samsung Electronics Co., Ltd.
0 cites