Patents/Inventors

Youngkyu Lim

Cheonan-siKR1 patent

2 Patents

US121763082024
Package Substrate and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites
US117569082023
Package Substrate Including a Redistribution Pad Extending from a Redistribution Layer and Including Segmenting Grooves Along a Redial Direction Thereof and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites