4 Patents
- US126223212026Semiconductor Device Including Through-silicon via (TSV) Test Device and Operating Method Thereof
Industry-academic Cooperation Foundation, Yonsei University
0 cites - US125688602026Semiconductor Device Including Through-silicon via (TSV) Test Device and Operating Method Thereof
Industry-academic Cooperation Foundation, Yonsei University
0 cites - US122835292025Method of Repairing Through-electrodes, Repair Device Performing the Same and Semiconductor Device Including the Same
Samsung Electronics Co., Ltd.
0 cites - US117514652023Mask Frame Assembly and Method of Manufacturing Organic Light-emitting Display Apparatus Using the Same
Samsung Display Co., Ltd.
0 cites