Patents/Inventors

Younggwan Ko

Suwon-siKR3 patents

4 Patents

US122180992025
Interposer and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119358472024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118429502023
Package Module
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118375372023
Fan-out Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites