15 Patents
- US126081572026Nonvolatile Memory Device, Controller for Controlling the Same, Storage Device Having the Same, and Method of Operating the Same
Samsung Electronics Co., Ltd.
0 cites - US126044772026Semiconductor Device with Conductive Layers in Isolation Structures
Samsung Electronics Co., Ltd.
0 cites - US125384812026Semiconductor Device and Memory System Including Multiple Conductive Layers
Samsung Electronics Co., Ltd.
0 cites - US125388422026Three-dimensional Storage Device Using Wafer-to-wafer Bonding
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US124904372025Non-volatile Memory Device and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US123216112025Memory Device, Memory System, and Method of Operating the Memory System
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
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- US121255342024Storage Device Using Wafer-to-wafer Bonding and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US120945352024Nonvolatile Memory Devices for Reducing Degradation Due to Difference of Threshold Voltage Distributions Between Outer Cells and Inner Cells
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US120337062024Method of Operating Nonvolatile Memory Device, Nonvolatile Memory Device and Memory Controller Performing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US119890912024Memory System for Performing Recovery Operation, Memory Device, and Method of Operating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US119013212024Three-dimensional (3D) Storage Device Using Wafer-to-wafer Bonding
Samsung Electronics Co., Ltd.
0 cites