Young Hoon Hyun

2 Patents

• US120573662024

  Semiconductor Devices Including a Lower Semiconductor Package, an Upper Semiconductor Package on the Lower Semiconductor Package, and a Connection Pattern Between the Lower Semiconductor Package and the Upper Semiconductor Package

  Samsung Electronics Co., Ltd.

  0 cites
• US116005452023

  Semiconductor Devices Including a Lower Semiconductor Package, an Upper Semiconductor Package on the Lower Semiconductor Package, and a Connection Pattern Between the Lower Semiconductor Package and the Upper Semiconductor Package

  Samsung Electronics Co., Ltd.

  0 cites