20 Patents
- US125000352025Multilayer Electronic Component and Board Having Multilayer Electronic Component Mounted Thereon
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US124068102025Ceramic Electronic Component Having External Electrode Which Includes Boron with High Ratio of Isotope 10B
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US117696332023Board Having Multilayer Capacitor Mounted Thereon and Multilayer Capacitor Package
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US117333152023Apparatus for Detecting Stacking Direction of Internal Electrode of Multilayer Capacitor and Detecting Method Thereof
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US116948482023Multilayered Ceramic Capacitor, Mounting Structure of Circuit Board Having Thereon Multilayered Ceramic Capacitor, Packing Unit for Multilayered Ceramic Capacitor
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US116315392023Capacitor Component Having Side Margin Portion Including Margin Electrode
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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