3 Patents
- US126108392026Packaged Microelectronic Devices Having Stacked Interconnect Elements and Methods for Manufacturing the Same
Micron Technology, Inc.
0 cites - US121659862024Semiconductor Package Using Cavity Substrate and Manufacturing Methods
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. Ltd.
0 cites - US120516112024Carrier Assisted Substrate Method of Manufacturing an Electronic Device and Electronic Device Produced Thereby
Amkor Technology Singapore Holding Pte. Ltd.
0 cites