Young Ah Song

4 Patents

• US124512942025

  Multilayer Electronic Component Containing Coated Conductive Particles and Method of Manufacturing the Multilayer Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US123548082025

  Multilayer Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US123476222025

  Multilayer Electronic Component with a Copper-containing External Electrode

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites
• US117639922023

  Electronic Component

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

  0 cites