Youn Sung Ko

6 Patents

• US126108412026

  Method of Bonding Column Type Deposits

  PROTEC CO., Ltd.

  0 cites
• US125685892026

  Method of Bonding Column Type Deposits

  PROTEC CO., Ltd.

  0 cites
• US123250882025

  Head Assembly for Mounting Conductive Ball

  PROTEC CO., Ltd.

  0 cites
• US122372962025

  System for Laser Bonding of Flip Chip

  PROTEC CO., Ltd.

  0 cites
• US122179952025

  Method of Mounting Conductive Balls Using Electrostatic Chuck

  PROTEC CO., Ltd.

  0 cites
• US118108902023

  Flip-chip Bonding Apparatus Using VCSEL Device

  PROTEC CO., Ltd.

  0 cites