Youn Jin Cho

3 Patents

• US121396422024

  CMP Slurry Composition for Polishing Tungsten Pattern Wafer and Method of Polishing Tungsten Pattern Wafer Using the Same

  SAMSUNG SDI CO., Ltd.

  0 cites
• US116084712023

  Composition for Etching Silicon Nitride Film and Etching Method Using Same

  SAMSUNG SDI CO., Ltd.

  0 cites
• US115604952023

  CMP Slurry Composition for Polishing Tungsten Pattern Wafer and Method of Polishing Tungsten Pattern Wafer Using the Same

  SAMSUNG SDI CO., Ltd.

  0 cites