You-wei Lin

4 Patents

• US122305982025

  Semiconductor Package

  MEDIATEK Inc.

  0 cites
• US122058692025

  Method for Forming a Semiconductor Package

  MEDIATEK Inc.

  0 cites
• US117373512023

  Organic Semiconductor Material and Organic Photoelectric Device Using the Same

  RAYNERGY TEK INCORPORATION

  0 cites
• US115629482023

  Semiconductor Package Having Step Cut Sawn Into Molding Compound Along Perimeter of the Semiconductor Package

  MEDIATEK Inc.

  0 cites