5 Patents
- US124484902025Epoxy Resin Composition for Molding Semiconductor, Molding Film and Semiconductor Package Using the Same
LG CHEM, Ltd.
0 cites - 0 cites
- US119937312024Adhesive Composition for Semiconductor Circuit Connection and Adhesive Film Containing the Same
LG CHEM, Ltd.
0 cites - US117025202023Epoxy Resin Composition for Molding Semiconductor, Molding Film and Semiconductor Package Using the Same
LG CHEM, Ltd.
0 cites