Patents/Inventors

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TianjinCN1 patent

2 Patents

US120516422024
QFN Semiconductor Package, Semiconductor Package and Lead Frame
NXP USA, Inc.
0 cites
US119844082024
Cavity Formed in a Molding Compound of a Semiconductor Package to Reduce Mechanical Stress on a Portion of a Die in the Package, and Methods of Formation
NXP USA, Inc.
0 cites