Patents/Inventors

Yosuke Ishihara

TokyoJP5 patents

4 Patents

US123039732025
Production Method for Aluminum-diamond Composite
DENKA COMPANY LIMITED
0 cites
US119124892024
Package Accommodating Heat Dissipation Substrate and Packing Box
DENKA COMPANY LIMITED
0 cites
US119031682024
Heat Dissipation Member
DENKA COMPANY LIMITED
0 cites
US116826042023
Heat Dissipation Component and Method for Manufacturing Same
DENKA COMPANY LIMITED
0 cites