4 Patents
- US121990062025Bonded Body, Power Module Substrate, Power Module, Method for Manufacturing Bonded Body, and Method for Manufacturing Power Module Substrate
MITSUBISHI MATERIALS CORPORATION
0 cites - US119087682024Method of Manufacturing Bonded Body for Insulation Circuit Substrate Board and Bonded Body for Insulation Circuit Substrate Board
MITSUBISHI MATERIALS CORPORATION
0 cites - US117354342023Method for Producing Insulating Circuit Substrate with Heat Sink
MITSUBISHI MATERIALS CORPORATION
0 cites - US116768822023Method of Manufacturing Power Module Substrate Board and Ceramic-copper Bonded Body
MITSUBISHI MATERIALS CORPORATION
0 cites