Yoshiyuki Kageyama

4 Patents

• US120467052024

  Method of Manufacturing Light Source Device Having a Bonding Layer with Bumps and a Bonding Member

  NICHIA CORPORATION

  0 cites
• US117257962023

  Light-emitting Module, Vehicle Lamp, and Heat Dissipation Member

  NICHIA CORPORATION

  0 cites
• US116770622023

  Method of Manufacturing Light Source Device Having a Bonding Layer with Bumps and a Bonding Member

  NICHIA CORPORATION

  0 cites
• US116193682023

  Light-emitting Module

  NICHIA CORPORATION

  0 cites