Patents/Inventors

Yoshitaka Takezawa

TokyoJP9 patents

10 Patents

US121164512024
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Composite Material
RESONAC CORPORATION
0 cites
US121040092024
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Method of Producing Epoxy Resin Cured Product, Composite Material, Insulating Member, Electronic Appliance, Structural Material, and Vehicle
RESONAC CORPORATION
0 cites
US120717142024
Anisotropic Thermal Conductive Resin Fiber, Anisotropic Thermal Conductive Resin Member, and Manufacturing Method of These
RESONAC CORPORATION
0 cites
US120495382024
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Composite Material
SHOWA DENKO MATERIALS CO., Ltd.
0 cites
US120312452024
Anisotropic Thermal Conductive Resin Fiber, Anisotropic Thermal Conductive Resin Member, and Manufacturing Method of These
RESONAC CORPORATION
0 cites
US119199952024
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, and Composite Material
RESONAC CORPORATION
0 cites
US118406002023
Cured Epoxy Resin Material, Epoxy Resin Composition, Molded Article, and Composite Material
RESONAC CORPORATION
0 cites
US118406192023
Epoxy Resin Composition, Thermally-conductive Material Precursor, B-stage Sheet, Prepreg, Heat Dissipation Material, Laminate, Metal Substrate, and Printed Circuit Board
RESONAC CORPORATION
0 cites
US118145682023
Anisotropic Thermal Conductive Resin Member and Manufacturing Method Thereof
THE UNIVERSITY OF TOKYO
0 cites
US115604762023
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, and Composite Material
Showa Denko Materials Co., Ltd.
0 cites