Patents/Inventors

Yoshinori Ejiri

TokyoJP14 patents

13 Patents

US125448322026
Copper Paste, Wick Formation Method, and Heat Pipe
Resonac Corporation
0 cites
US123549142025
Method for Producing Substrate Having Through-silicon Vias, Substrate Having Through-silicon Vias, and Copper Paste for Through-silicon via Formation
Resonac Corporation
0 cites
US122463982025
Solder Bump Forming Member, Method for Manufacturing Solder Bump Forming Member, and Method for Manufacturing Electrode Substrate Provided with Solder Bump
RESONAC CORPORATION
0 cites
US122472702025
Anisotropic Conductive Film and Method for Producing the Anisotropic Conductive Film Including a Base Material Having Recesses and Solder Particles Formed Inside the Recesses
RESONAC CORPORATION
0 cites
US122334602025
Copper Paste, Wick Formation Method, and Heat Pipe
Resonac Corporation
0 cites
US121722402024
Solder Particles
RESONAC CORPORATION
0 cites
US121009232024
Connection Structure and Manufacturing Method Therefor
RESONAC CORPORATION
0 cites
US120708002024
Electronic Component and Method for Manufacturing Electronic Component
RESONAC CORPORATION
0 cites
US119903962024
Substrate and Method for Manufacturing the Same
RESONAC CORPORATION
0 cites
US118906812024
Method for Producing Bonded Object and Semiconductor Device and Copper Bonding Paste
RESONAC CORPORATION
0 cites
US118879602024
Member Connection Method
RESONAC CORPORATION
0 cites
US115750762023
Method for Manufacturing Thermoelectric Conversion Module, Thermoelectric Conversion Module, and Binder for Thermoelectric Conversion Module
Showa Denko Materials Co., Ltd.
0 cites
US115629512023
Organic Interposer and Method for Manufacturing Organic Interposer
SHOWA DENKO MATERIALS CO., Ltd.
0 cites