Patents/Inventors

Yoshinari Ikeda

MatsumotoJP17 patents

16 Patents

US125885642026
Semiconductor Device
FUJI ELECTRIC CO., Ltd.
0 cites
US125754392026
Semiconductor Device Including a Sealing Member to Seal a Semiconductor Chip, a Printed Circuit Board, and a Conductive Block
FUJI ELECTRIC CO., Ltd.
0 cites
US124890312025
Semiconductor Device and Manufacturing Method Thereof
FUJI ELECTRIC CO., Ltd.
0 cites
US124712972025
Semiconductor Device and Manufacturing Method Thereof
FUJI ELECTRIC CO., Ltd.
0 cites
US124514542025
Manufacturing Method of Packaging Structure for Bipolar Transistor with Constricted Bumps
FUJI ELECTRIC CO., Ltd.
0 cites
US124380562025
Semiconductor Device and Method for Determining Deterioration of Semiconductor Device
FUJI ELECTRIC CO., Ltd.
0 cites
US123946812025
Semiconductor Device
FUJI ELECTRIC CO., Ltd.
0 cites
US121912452025
Semiconductor Device Having a Curved Part in the Printed Circuit Board
FUJI ELECTRIC CO., Ltd.
0 cites
US121425592024
Semiconductor Device Comprising a Capacitor
FUJI ELECTRIC CO., Ltd.
0 cites
US120806122024
Semiconductor Device Having an Insulating Sheet and a Conductive Film, and Method of Manufacturing the Same
FUJI ELECTRIC CO., Ltd.
0 cites
US120721552024
Heat Exchanger Having Cured Edge
KOJIN CO., Ltd.
0 cites
US118879252024
Semiconductor Device Comprising a Capacitor
FUJI ELECTRIC CO., Ltd.
0 cites
US117054192023
Packaging Structure for Bipolar Transistor with Constricted Bumps
FUJI ELECTRIC CO., Ltd.
0 cites
US116643422023
Semiconductor Device with a Laser-connected Terminal
FUJI ELECTRIC CO., Ltd.
0 cites
US116582312023
Semiconductor Device
FUJI ELECTRIC CO., Ltd.
0 cites
US115454092023
Semiconductor Module Having Block Electrode Bonded to Collector Electrode and Manufacturing Method Thereof
FUJI ELECTRIC CO., Ltd.
0 cites