Patents/Inventors

Yoshihiro Tsutsumi

OsakaJP9 patents

9 Patents

US126108452026
Method for Forming Semiconductor Packages Using Dielectric Alignment Marks and Laser Liftoff Process
Tokyo Electron Limited
0 cites
US125603912026
Fin Assembling Method
DAIKIN INDUSTRIES, Ltd.
0 cites
US124214352025
Adhesive Composition for Flexible Printed-wiring Board (FPC), and Heat-curable Resin Film, Prepreg and FPC Substrate Containing Same
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US122642702025
Method for Producing Cured Product of Heat-curable Maleimide Resin Composition
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US121629712024
Heat-curable Maleimide Resin Composition
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US120124852024
Heat-curable Citraconimide Resin Composition
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US117731002023
Bismaleimide Compound and Production Method Thereof
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US116394102023
Heat-curable Resin Composition and Uses Thereof
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites
US116084382023
Low-dielectric Heat Dissipation Film Composition and Low-dielectric Heat Dissipation Film
SHIN-ETSU CHEMICAL CO., Ltd.
0 cites