Yoshihiro Tomita

9 Patents

• US126108172026

  Metal Matrix Composite Layers for Heat Dissipation from Integrated Circuit Devices

  Intel Corporation

  0 cites
• US125507682026

  Conformal Power Delivery Structures Near High-speed Signal Traces

  Intel Corporation

  0 cites
• US125327392026

  Metal Matrix Composite Layers Having Graded Filler Content for Heat Dissipation from Integrated Circuit Devices

  Intel Corporation

  0 cites
• US124380872025

  High Throughput Additive Manufacturing for Integrated Circuit Components Containing Traces with Feature Size and Grain Boundaries

  Intel Corporation

  0 cites
• US124314302025

  Technologies for High Throughput Additive Manufacturing for Integrated Circuit Components

  Intel Corporation

  0 cites
• US123043662025

  Vehicle Seat and Vehicle Seat Manufacturing Method

  TS TECH CO., Ltd.

  0 cites
• US121835962024

  Low Cost Package Warpage Solution

  Intel Corporation

  0 cites
• US119554342024

  Ultra Small Molded Module Integrated with Die by Module-on-wafer Assembly

  Intel Corporation

  0 cites
• US117640802023

  Low Cost Package Warpage Solution

  Intel Corporation

  0 cites