11 Patents
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- US122407512025Sensor Package Substrate, Sensor Module Having the Same, and Sensor Package Substrate Manufacturing Method
TDK Corporation
0 cites - US122438412025Electronic Component Embedded Substrate and Circuit Module Using the Same
TDK Corporation
0 cites - 0 cites
- US121257542024Sensor Package Substrate, Sensor Module Including the Same, and Electronic Component Embedded Substrate
TDK CORPORATION
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- US116826282023Semiconductor Ic-embedded Substrate Having Heat Dissipation Structure and Its Manufacturing Method
TDK CORPORATION
0 cites - 0 cites