18 Patents
- 0 cites
- 0 cites
- 0 cites
- 0 cites
- US123744972025Multilayer Electronic Component with Improved Reliability
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US123548032025Multilayer Electronic Component Having Structure for Improved Adhesion Force and Moisture Protection
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
- US122550222025Multilayer Electronic Component Having Insulating Layer Which Includes Fluorine-based Organic Material
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
- 0 cites
- 0 cites
- 0 cites
- 0 cites
- 0 cites
- US118428532023Multilayered Electronic Component and Method of Manufacturing the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - 0 cites
- 0 cites
- 0 cites