20 Patents
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- US125507392026Semiconductor Package Including a Metal Plate and Package-on-package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
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- US124381342025Package Substrate and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US124009702025Semiconductor Package Including Electromagnetic Shield Structure
Samsung Electronics Co., Ltd.
0 cites - US123082532025Molded Product for Semiconductor Strip and Method of Manufacturing Semiconductor Package
Samsung Electronics Co., Ltd.
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- US120573572024Semiconductor Package Including Plurality of Recesses and Molding Member with Plurality of Protrusions That Fill the Recesses
SAMSUNG ELECTRONICS CO, Ltd.
0 cites - US117422942023Interposers and Semiconductor Packages Including the Same
Samsung Electronics Co., Ltd.
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- US117281422023Apparatus for Conducting Plasma Surface Treatment, Board Treatment System Having the Same
New Power Plasma CO., Ltd.
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