Patents/Inventors

Yongkoon Lee

Suwon-siKR9 patents

11 Patents

US123278262025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US121836942024
Semiconductor Package Including Antenna
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121548732024
Semiconductor Package Including Antenna
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120402482024
Semiconductor Package Including Heat Spreader Layer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120402992024
Semiconductor Package and Method of Manufacturing the Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119358472024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119358492024
Semiconductor Package with an Antenna Substrate
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117355532023
Semiconductor Package and Method of Manufacturing the Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116370792023
Semiconductor Package Including Antenna
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115695632023
Semiconductor Packages and Method of Manufacturing Semiconductor Packages
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115629392023
Semiconductor Package Including Heat Spreader Layer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites