Patents/Inventors

Yongjun J. Hu

Boise, IDUS10 patents

10 Patents

US124314072025
Memory Device with Low Density Thermal Barrier
Micron Technology, Inc.
0 cites
US121702502024
Microelectronic Devices and Memory Devices Including Conductive Levels Having Varying Compositions
Micron Technology, Inc.
0 cites
US121711012024
Microelectronic Devices Including Conductive Structures
Micron Technology, Inc.
0 cites
US119903672024
Apparatus and Memory Device Including Conductive Lines and Contacts, and Methods of Forming an Apparatus Including Conductive Lines and Contacts
0 cites
US119843822024
Memory Device with Low Density Thermal Barrier
Micron Technology, Inc.
0 cites
US116721912023
Semiconductor Devices Comprising Threshold Switching Materials
Micron Technology, Inc.
0 cites
US116597782023
Composite Electrode Material Chemistry
Micron Technology, Inc.
0 cites
US116318112023
Wsige Electrode Structures for Memory Devices, and Associated Devices and Systems
Micron Technology, Inc.
0 cites
US115944952023
Microelectronic Devices Including Conductive Levels Having Varying Compositions, and Related Memory Devices, Electronic Systems, and Methods
Micron Technology, Inc.
0 cites
US115456232023
Fabrication of Electrodes for Memory Cells
Micron Technology, Inc.
0 cites