Patents/Inventors

Yonghwan Kwon

Suwon-siKR14 patents

15 Patents

US125507492026
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124567042025
Semiconductor Package and Method for Manufacturing Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123158242025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122879602025
Electronic Apparatus and Controlling Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122611032025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US121912212025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US120274322024
Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites
US119963782024
Semiconductor Package and Method for Manufacturing Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119617922024
Fan-out Semiconductor Package Including Under-bump Metallurgy
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118536402023
Display Apparatus and Method of Controlling the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118549122023
Semiconductor Package Including a Chip Pad Having a Connection Portion and Test Portion in a First Surface of the Chip Pad
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117355712023
Semiconductor Package Including a Redistribution Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115691372023
Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites
US115454222023
Fan-out Semiconductor Package Including Under-bump Metallurgy
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115454402023
Semiconductor Package
Samsung Electronice Co., Ltd.
0 cites