Yonghoe Cho

7 Patents

• US124397152025

  Image Sensor Package and System Having the Same

  Samsung Electronics Co., Ltd.

  0 cites
• US124314742025

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US118698182024

  Chip-stacked Semiconductor Package and Method of Manufacturing Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US118625962024

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US118240762023

  Semiconductor Package Including an Image Sensor Chip and a Method of Fabricating the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US117769412023

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US115520372023

  Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites