Patents/Inventors

Yonghao An

San Diego, CAUS2 patents

3 Patents

US118044282023
Mixed Pad Size and Pad Design
QUALCOMM INCORPORATED
0 cites
US116768732023
Semiconductor Package Having Sealant Bridge
Intel Corporation
0 cites
US115454112023
Package Comprising Wire Bonds Configured as a Heat Spreader
QUALCOMM INCORPORATED
0 cites