7 Patents
- US123477952025Semiconductor Package Including Uneven Structures and Electronic Device Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US122835762025Electronic Device Including Thermal Interface Material Layer and Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
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- US120385582024Curved Glass Comprising Anti-reflection and Anti-scratch Coating Layer and Electronic Device
Samsung Electronics Co., Ltd.
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