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Yong-zhong Hu
Cupertino, CA
US
7 patents
6 Patents
US12512395
2025
Chip Packaging Method and Chip Package Unit
RICHTEK TECHNOLOGY CORPORATION
0 cites
US12362186
2025
Pip Structure and Manufacturing Methods of High Voltage Device and Capacitor Device Having PIP Structure
RICHTEK TECHNOLOGY CORPORATION
0 cites
US12300565
2025
Chip Package Unit and Chip Packaging Method
RICHTEK TECHNOLOGY CORPORATION
0 cites
US12272592
2025
High Voltage Device and Manufacturing Method Thereof
RICHTEK TECHNOLOGY CORPORATION
0 cites
US12062570
2024
High Voltage Device and Manufacturing Method Thereof
RICHTEK TECHNOLOGY CORPORATION
0 cites
US11973010
2024
Chip Packaging Method and Chip Package Unit
RICHTEK TECHNOLOGY CORPORATION
0 cites