Yong Woo Hyung

2 Patents

• US124009582025

  Method for Forming Semiconductor Device Having an Air Gap Between a Contact Pad and a Sidewall of Contact Hole

  Fujian Jinhua Integrated Circuit Co., Ltd.

  0 cites
• US120573962024

  Semiconductor Device Having an Air Gap Between a Contact Pad and a Sidewall of Contact Hole

  Fujian Jinhua Integrated Circuit Co., Ltd.

  0 cites