14 Patents
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- US124944212025Semiconductor Package Including Redistribution Structure, and Method of Manufacturing the Same
NEPES CO., Ltd.
0 cites - US124273462025P62 Ligand Compound, and Composition for Preventing, Ameliorating or Treating Proteinopathies Comprising the Same
AUTOTAC Inc.
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- US121989972025Semiconductor Package Comprising First Molding Layer and Second Molding Layer with Different Thermal Expansion Coefficients
NEPES CO., Ltd.
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- US120653942024Compound and Pharmaceutical Composition for Preventing or Treating Obesity or Metabolic Syndrome Comprising Thereof
Seoul National University R&dbfoundation
0 cites - US119816182024P62 Ligand Compound, and Composition for Preventing, Ameliorating or Treating Proteinopathies Comprising the Same
AUTOTAC Inc.
0 cites - US117533762023Benzyloxy Pyridine Derivatives and Uses Thereof
SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
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