Patents/Inventors

Yong She

ShanghaiCN10 patents

9 Patents

US125123602025
Chip Transfer Method and Electronic Device
Huawei Technologies Co., Ltd.
0 cites
US120465812024
Integrated Circuit Package with Glass Spacer
Intel Corporation
0 cites
US120274962024
Film in Substrate for Releasing Z Stack-up Constraint
Intel Corporation
0 cites
US119903952024
Joint Connection of Corner Non-critical to Function (NCTF) Ball for BGA Solder Joint Reliability (SJR) Enhancement
Intel Corporation
0 cites
US118943442024
Power Enhanced Stacked Chip Scale Package Solution with Integrated Die Attach Film
Intel Corporation
0 cites
US118814412024
Stacked Die Semiconductor Package Spacer Die
Intel Corporation
0 cites
US118482812023
Die Stack with Reduced Warpage
Intel Corporation
0 cites
US118308482023
Electronic Device Package
Intel Corporation
0 cites
US117422842023
Interconnect Structure Fabricated Using Lithographic and Deposition Processes
Intel Corporation
0 cites