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Yong Poo Chia
Singapore
SG
1 patent
2 Patents
US12087738
2024
Packaged Integrated Circuit Devices with Through-body Conductive Vias, and Methods of Making Same
0 cites
US11594525
2023
Packaged Integrated Circuit Devices with Through-body Conductive Vias, and Methods of Making Same
Micron Technology, Inc.
0 cites