Yoji Sawada

5 Patents

• US120339272024

  Method for Manufacturing Wiring Substrate

  IBIDEN CO., Ltd.

  0 cites
• US119358222024

  Wiring Substrate Having Metal Post Offset from Conductor Pad and Method for Manufacturing Wiring Substrate

  IBIDEN CO., Ltd.

  0 cites
• US117495962023

  Wiring Substrate

  IBIDEN CO., Ltd.

  0 cites
• US116784402023

  Printed Wiring Board and Method for Manufacturing Printed Wiring Board

  IBIDEN CO., Ltd.

  0 cites
• US116224462023

  Wiring Substrate

  IBIDEN CO., Ltd.

  0 cites