Patents/Inventors

Yoichi Shiokawa

TokyoJP7 patents

7 Patents

US125042732025
Measuring Film-thickness of a Workpiece in a Semiconductor Processing Apparatus Using a Composite Spectrum
EBARA CORPORATION
0 cites
US124966772025
Polishing Apparatus and Polishing Method
EBARA CORPORATION
0 cites
US120625632024
Substrate Processing Apparatus, Substrate Processing System, and Substrate Processing Method
EBARA CORPORATION
0 cites
US119515882024
Optical Film-thickness Measuring Apparatus and Polishing Apparatus
EBARA CORPORATION
0 cites
US119118672024
Polishing Apparatus and Polishing Method
EBARA CORPORATION
0 cites
US118336362023
Substrate Polishing Apparatus, Method of Creating Thickness Map, and Method of Polishing a Substrate
EBARA CORPORATION
0 cites
US117599132023
Polishing Method and Polishing Apparatus
EBARA CORPORATION
0 cites