Patents/Inventors

Yohei Onishi

KyotoJP1 patent

2 Patents

US118337222023
Resin Molding Apparatus and Method of Manufacturing Resin Molded Product
Towa Corporation
0 cites
US117128232023
Molding Die for Compression Molding with Resin Leakage Prevention Member
TOWA CORPORATION
0 cites