Patents/Inventors

Yohei Masuda

TokyoJP2 patents

3 Patents

US124513882025
Dividing Method of Workpiece
DISCO CORPORATION
0 cites
US124179382025
Processing Apparatus for Integrating a Semiconductor Wafer and an Annular Frame Through a Tape
DISCO CORPORATION
0 cites
US121286642024
Affixing Method and Affixing Apparatus
DISCO CORPORATION
0 cites